Big names working on joint standard

The world will see electronics giants NTT DoCoMo, Renesas, Fujitsu, Mitsubishi Electric, Sharp, and Sony Ericsson work together to develop a platform for next-generation 3G cellphones. These new handsets will sport dual-mode capability, supporting HSDPA/W-CDMA (3G) and GSM/GPRS/EDGE (2G), with a targeted completion date of Q2 2008. This new platform will be based on the SH-Mobile G3 single chip system that integrates a baseband processor which supports HSDPA/W-CDMA and GSM/GPRS/EDGE communications. Such standardization is always good for the consumer as there will be less headaches when it comes to compatibility issues.